Sponsored by IEEE Region 4 (R4), in cooperation with Lewis University and the IEEE Chicago Section.

 

Submissions of quality industry papers/presentations describing ideas or implementations in all areas of information technology and engineering solutions relevant to industrial applications and of interest to practicing and professional engineers are requested.

 

Please provide a 300 word summary of your industrial application paper or presentation to https://eit-conference.org/eit2023. The Conference also encourages exhibits by the industry presenters and Conference Sponsors to promote their industry. Please visit https://www.eit-conference.org/eit2023/sponsorship.php for more information on being a Conference Sponsor.

 

NOTE: THE INDUSTRY PAPERS WILL BE PUBLISHED IN THE CONFERENCE PROCEEDINGS BUT NOT IN IEEE XPLORE UNLESS THEY ARE SUBMITTED AS REGULAR CONFERENCE PAPERS. IDENTIFY YOUR INDUSTRY PAPER/PRESENTATION AS "INDUSTRIAL" WHEN SUBMITTING

 

Topics of interest include but are not limited to:
Robotics and Mechatronics Intelligent Systems and Multi-agent Systems Control Systems and System Identification Reconfigurable and Embedded Systems Power Systems and Power Electronics Solid State, Consumer and Automotive Electronics Electronic Design Automation Biomedical Applications, Telemedicine Biometrics and Bioinformatics Nanotechnology Micro Electromechanical Systems Electric Vehicles	Wireless Communications and Networking Ad Hoc and Sensor Networks Internet of Things Artificial Intelligence and Machine Learning Cybersecurity Computer Vision Signal/Image and Video Processing Distributed Data Fusion and Mining Cloud, Mobile, and Distributed Computing Software Engineering and Middleware Architecture Engineering Education and Engineering Management
Important dates: Submission of 300-word summary: March 15, 2023 Submission of final paper: March 30, 2023 Notification of acceptance: April 15, 2023 Early registration: April 15, 2023	For more information, please contact:   Dr. Hamid Vakilzadian Jim Riess